Phase Change Gel Thermal Pad: CGD / CGDR Series

50 °C phase change material secures close contact with heating elements and easy and clean handling.
Phase change material appears to be like any normal thermal pad at room temperature, but when heated to 50 °C, it transforms into a liquid to fill in any gaps between the heat sink and the heat source before becoming a solid again after cooling. It’s great for ensuring that even spaces with irregular shapes will be covered completely without the chance of leaving air gaps.

  • Thermal interface material for use between heating elements and heat sink.
  • Low thermal resistance and highly conformable.
  • Easy and clean handling – Solid at room temperature and no need for measurement like grease.
  • Silicone-free material – eliminates concerns over contact failure due to siloxane gas.
  • CGD Series operating temperature -20 ~ +100 °C
  • CGDR Series operating temperature -20 ~ +90 °C
Features: Phase Change Gel Thermal Pad

The gel sheet phase changes to high-viscosity liquid from the heat of the IC and fills air gap, effectively transferring the heat to heat sink to lower the temperature and reduce EMC noise.


CGD Series

Cross-section-View: CGD Phase Change Gel Thermal Pad

CGDR Series

Cross-section-View: CGDR Phase Change Gel Thermal Pad

Typical Properties

ItemTest MethodCGDCGDR
Standard Sheet Size200 x 200
Thickness0.25, 0.50.15, 0.25, 0.5
ColorVisual CheckGray
Phase Change Temperature50 °C
Operating Temperature-20 ~ 100 °C-20 ~ 90 °C
Thermal Conductivity (W/m・K)*JIS R 26162.0
Volume Resistivity (Ω・cm)*JIS K 69111.0 x 1014
CarrierN/APET (one side)

* Specifications and dimensions are subject to change without notice for product improvement.