Phase Change Gel Thermal Pad: CGD / CGDR Series
50 °C phase change material secures close contact with heating elements and easy and clean handling.
Phase change material appears to be like any normal thermal pad at room temperature, but when heated to 50 °C, it transforms into a liquid to fill in any gaps between the heat sink and the heat source before becoming a solid again after cooling. It’s great for ensuring that even spaces with irregular shapes will be covered completely without the chance of leaving air gaps.
- Thermal interface material for use between heating elements and heat sink.
- Low thermal resistance and highly conformable.
- Easy and clean handling – Solid at room temperature and no need for measurement like grease.
- Silicone-free material – eliminates concerns over contact failure due to siloxane gas.
- CGD Series operating temperature -20 ~ +100 °C
- CGDR Series operating temperature -20 ~ +90 °C
The gel sheet phase changes to high-viscosity liquid from the heat of the IC and fills air gap, effectively transferring the heat to heat sink to lower the temperature and reduce EMC noise.
Structure
CGD Series
CGDR Series
Typical Properties
| Item | Test Method | CGD | CGDR |
|---|---|---|---|
| Standard Sheet Size | – | 200 x 200 | |
| Thickness | – | 0.25, 0.5 | 0.15, 0.25, 0.5 |
| Color | Visual Check | Gray | |
| Phase Change Temperature | – | 50 °C | |
| Operating Temperature | – | -20 ~ 100 °C | -20 ~ 90 °C |
| Thermal Conductivity (W/m･K) | *JIS R 2616 | 2.0 | |
| Volume Resistivity (Ω･cm) | *JIS K 6911 | 1.0 x 1014 | |
| Carrier | – | N/A | PET (one side) |
* Specifications and dimensions are subject to change without notice for product improvement.