Stop by KGS America’s booth #208 at Grand Rapids on July 31 – August 4, 2023

The 2023 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) will bring together the world’s top researchers and industry-leading companies to share ideas and advances in the field. Over the years, attendance has grown to some 1,500 to 2,000 engineers, technicians, and exhibitors representing industry (65%), academia (25%), and government (10%) organizations.

Expo Hours:
Tue, August 1, 2023 9:30 a.m. – 4:00 p.m.
Wed, August 2, 2023 10:00 a.m. – 5:00 p.m.
Thu, August 3, 2023 10:00 a.m. – 1:00 p.m.

IEEE SIPI 2023
Grand Rapids

303 Monroe Ave NW, Grand Rapids, MI 49503

DeVos Place is a premier convention center located in downtown Grand Rapids. DeVos Place offers a unique combination of meeting and exhibition space to accommodate a variety of events. Downtown Grand Rapids is located 15 minutes from Gerald R. Ford International Airport and easily accessible from all major interstates.

KITAGAWA INDUSTRIES America is featuring the following products at this IEEE SIPI 2023.

KGS America Inc. Exhibitor Booth #208

Four product types related to optical communications and networking professionals applications (EMI Ferrite / Ferrite Core, Thermal Pads, EMI Grounding, Vibration Damping Materials) are introduced here. Please feel free to contact us as there are many related products other than these products.

Oblong-shaped automotive-grade ferrite for suppressing common mode noise (cables comfortably set side-by-side). Low profile provides space saving compared with the conventional type. Housing with anti-slip means for cable tie around its outer side. Optimal for onboard charging cables and inverter power cables that have limited space for conducted noise suppression. Satisfied requirement of ISO 16750-3 Ⅱ vibration test for road vehicles. Operating temperature -40 ~ 125 °C

Low Cut Ferrite Clamp: BFCWN-MA Series / Block Ferrite Clamp: BFCWN-A Series
On‐board Contact for Parallel EMC Grounding: OG-503253-A

SMT grounding contact for engine compartment PCB. Spring mechanism capable of withstanding 10 million deflections caused by engine vibration.
Sustained conduction is secured because of unique dimple design. Can be used under high temperature at 150 ºC.

Soft, 2W/m•K silicone-free putty-thermal pad. Super compliable (ASKER C 0) material sandwiched between thin permanent PET film and light tacky layer for easy handling. Thin permanent PET film provides mechanical strength and prevents dust and debris from getting trapped on the putty surface. Because the CPVP is so soft, very little pressure is applied to components. No concerns for siloxane outgassing or oil bleeding. Operating temperature: -40 ~ 125˚C. Custom die-cutting available upon request.

Silicone Free Thermal Pad: CPVP-F Series

Please feel free to contact us with any questions regarding the above products. There is live chat on this site.