On‐board Contact for Parallel EMC Grounding: OG-503253-A
SMT grounding contact for engine compartment PCB.
- Spring mechanism capable of withstanding 10 million deflections caused by engine vibration.
- Sustained conduction is secured because of unique dimple design.
- Can be used under high temperature at 150 ºC.
- RoHS Compliant
- Automotive Grade
Dimensions (mm)
Pad and Mask Dimensions (mm)
Compression Force vs Electric Resistance
| Part No. | OG‐503253‐A |
|---|---|
| Applications |
[/fusion_text]Ground clip for SMD |
| Length | 5.0 mm |
| Width | 3.2 mm |
| Height* | 5.25 mm |
| Recommended Gap | 3.5 ~ 4.5 mm |
| Base Material | Beryllium Copper |
| Surface Treatment | Sn plating, Cu undercoat |
| Qty per Reel | 2,000 pcs |
| Operating Temperature | ‐40 ~ 150 °C |
* Dimple included on the top surface of OG‐503253‐A to maintain metal‐to‐metal connection during vibration.
Heat-shock Test
- Temperature switch: -40 °C/150 °C (0.5 hour each)
- Number of cycle: 2000 cycles
- Metal plate: Aluminum (ADC 12)
- Test method: Sample is compressed by metal plate while heat is applied.
- After a set of 250 cycles the DC resistance value is measured.
Compression Test
| Before | After | |
|---|---|---|
| External status |
 |
 |
| Height (mm) | 5.263 | 5.226 |
| Recovery rate (%) | – | 99.7 |
- Deflection: H=3.5 mm ~ 3.9 mm
- Compression count : 10 million times
- Compression speed: 100 times/sec
- Test method: Height measured and visual check after compressed 3.5 mm ~ 3.9 mm deflections for 10 million times.
* Specifications and dimensions are subject to change without notice for product improvement.