KGS America’s TIM products are designed for performance and material softness with the intent to increase the rate of heat transfer away from the heat source and to eliminate trapping air bubbles that can potentially trap heat. KGS thermal products are thermally conductive but not electrically conductive, so they can be placed on a PCB without electrical-shorting concerns.
KGS thermal solutions are broadly categories into three groups: silicone-based thermal pads (popular and most cost-effective), silicone-free thermal pads (material hardness ranging from Shore 00: 30 to 70), and special thermal solutions (including dual function EMI absorber and thermal pad, vibration damper and thermal pad, light-weight ceramic heat sink, and aluminum heat spreader). Choosing among these options will largely governed by your application requirements (such as available gap space, siloxane-outgassing concerns, material hardness, automotive-grade requirements, device operating temperature, among others).
When applying thermal pads to your design, 15~30% compression of the pad is recommended to ensure good mating between the heat source and heat sink. KGS thermal solutions have also been used successfully without a heat sink.