Thermal Pads & Thermal Interface Materials

Even as technology advances to high performance and compact designs, engineers are constantly challenged to innovate creative ways to manage heat. An application’s thermal management can be crucial in increasing its life expectancy and brand reliability.

Thermal Interface Materials (TIMS) are placed between the heat source (such as a microprocessor) to a heat sink or heat spreader. Filling the air gap with a pad or putty allows for an efficient transfer of heat away from the heat source to maintain its performance. Considering the thermal conductivity of air is about 0.02W/m*K (which tends to insulate heat), applying even a low thermal conductivity 1.5 W/m*K thermal pad can dramatically change the junction temperature of the heat source.

KGS America’s TIM products are designed for performance and material softness with the intent to increase the rate of heat transfer away from the heat source and to eliminate trapping air bubbles that can potentially trap heat. KGS thermal products are thermally conductive but not electrically conductive, so they can be placed on a PCB without electrical-shorting concerns.

KGS thermal solutions are broadly categories into three groups: silicone-based thermal pads (popular and most cost-effective), silicone-free thermal pads (material hardness ranging from Shore 00: 30 to 70), and special thermal solutions (including dual function EMI absorber and thermal pad, vibration damper and thermal pad, light-weight ceramic heat sink, and aluminum heat spreader). Choosing among these options will largely governed by your application requirements (such as available gap space, siloxane-outgassing concerns, material hardness, automotive-grade requirements, device operating temperature, among others).

When applying thermal pads to your design, 15~30% compression of the pad is recommended to ensure good mating between the heat source and heat sink. KGS thermal solutions have also been used successfully without a heat sink.

Our IMTH series silicone-based thermal pads are one of our TIM (Thermal Interface Materials) which are one of our most popular thermal management components. They are designed to withstand high temperatures (up to 200°C) and has very low outgassing compared to similar silicone-based TIM’s. KITAGAWA INDUSTRIES America offers a wide variety from 1.5 W/m*K up to 7.0 W/m*K. Our standard product is inherently tacky on both sides. We also offer options such as one-side less tacky, fiberglass reinforced and lower durometer versions.

IMTH15 Series

IMTH15 Series thermal pads have a high conductivity of 1.5 W/m*K and is available in 0.3 mm to 25 mm thicknesses. They are also cost effective thermal management solutions.

IMTH30 Series

MTH30 series thermal pads have a high conductivity of 3.0 W/m*K and is available in 0.3 mm to 10 mm thicknesses. They are also cost effective thermal management solutions.

IMTH50 Series

IMTH50 series thermal pads have a high conductivity of 5.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses. They are also the superior and longer lasting solutions in comparison to thermal grease.

IMTH70 Series

IMTH70 series thermal pads have a high conductivity of 7.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses. They are also the superior and longer lasting solutions in comparison to thermal grease.

Many applications today such as optical, medical, and sensor devices certain requirements preventing them from using silicone based products. To meet these demands, KITAGAWA INDUSTRIES America offers a variety of silicone-free thermal pads. We use an acrylic rubber base to eliminate any concerns of siloxane outgassing and oil-bleeding. Our silicone-free thermal pads are very soft which is beneficial for reducing applied stress on the PCB and lowering the thermal resistance.

Phase Change Gel Thermal Pad: CGD/CGDR Series

Phase change material appears to be like any normal thermal pad at room temperature, but when heated to 50° C, it transforms into a liquid to fill in any gaps between the heat sink.

Change Gel Thermal Pad + EMC Dual Function: CGE Series

Thin + Dual functional sheet for EMC and thermal management. Phase Change at 50 degrees C to secure close contact with heating elements. Very thin : 0.25mm.

Thermal Pad and Vibration Damper: CPAG Series

Silicone-Free, heat-conductive vibration damping sheet. Silicone-free material, so there is no siloxane outgassing. Suitable for applications with both thermal and vibration/shock issues.

Silicone Free Thermal Pad: CPSH Series

Soft, 5W/m•K silicone-free thermal pad for high operating temperature applications. Compliable thermal pad helps to crowd out air bubbles to reduce thermal resistance.

Ultra-Soft Silicone-Free Thermal Pad: CPSS Series

Super soft and compliable material allows for less pressure on the heat source, such as the IC or PCB, when compared to a standard TIM. Suitable for vibration control.

Silicone Free Thermal Pad: CPVH Series

Soft, 3W/m・K silicone-free thermal pad for high operating temperature applications. One side thin permanent PET film and one side naturally tacky is standard.

Silicone Free Thermal Pad: CPVS Series

Soft (ASKER C 18) silicone-free thermal pad. Excellent stress relaxation property reduces the stress on the elements after mounting. Overall low outgassing.

Silicone Free Thermal Pad: CPVP-F Series

Super compliable (ASKER C 0) material sandwiched between thin permanent PET film and light tacky layer for easy handling. Because the CPVP is so soft, very little pressure is applied to components.

Silicone Free Thermal Pad: CPVT Series

Ultra-thin, thermally conductive sheet, suitable for devices where clearance is limited. Available thicknesses ranging from 0.1 mm ~ 0.25 mm at every 0.05 mm pitch.

EMI Absorber and Thermal Pad: EMPV4-F Series

Ultra-thin, thermally conductive sheet, suitable for devices where clearance is limited. Available thicknesses ranging from 0.1 mm ~ 0.25 mm at every 0.05 mm pitch.

EMI Absorber and Thermal Pad: EMPV5-F Series

Silicone-free material, great for applications sensitive to siloxane and oil-bleeds. KGS-original formulation allows for great EMC noise suppression.

With an increasing number of applications dealing with more than one issue in the same location, our silicone-free dual functioning materials are a cost effective solution for resolving both problems at the same time. Some examples are our EMPV4 (Dual functioning Thermal pad and EMI Absorber) and CPAG (Dual functioning Thermal pad and Vibration Dampener). Upon special request, KITAGAWA INDUSTRIES America can also layer two or more of our silicone-free materials into one without trapping any air bubbles. Multiple layered products are fused together during manufacturing in such a way that the layers will not come apart.

Change Gel Thermal Pad + EMC Dual Function: CGE Series

Thin + Dual functional sheet for EMC and thermal management. Phase Change at 50 degrees C to secure close contact with heating elements. Very thin : 0.25 mm.

Thermal Pad and Vibration Damper: CPAG Series

Silicone-Free, heat-conductive vibration damping sheet. Silicone-free material, so there is no siloxane outgassing. Suitable for applications with both thermal and vibration/shock issues.

EMI Absorber and Thermal Pad: EMPV4-F Series

Silicone-free thermal interface material with EMI noise suppression. Compliable material (ASKER C 40) that conforms to uneven surfaces. High operating temperature from -40 ~ + 110 ° C.

EMI Absorber and Thermal Pad: EMPV5-F Series

Silicone-free material, great for applications sensitive to siloxane and oil-bleeds. KGS-original formulation allows for great EMC noise suppression.

Our Special TIM (Thermal Interface Materials) include our Ceramic Heat Sink and Thermal Heat Spreader. The ceramic heat sink has a greater surface area due to its porous structure which allows for effective dissipation of heat.
Our cost effective aluminum heat spreader is a great solution for evenly distributing heat throughout, preventing a hot spot from occurring.

Ceramic Heat Sink: CECD Series

Compared to traditional aluminum, the combination of the larger surface area provided by the porous structure and higher levels of thermal radiation amounts to superior heat dissipation.

Thermal Heat Spreader: HSD Series

Thin and flexible heat spreading sheet for superior thermal management. Aluminum heat spreader material with excellent thermal conductivity (221 W/m·K).

  • our thermal interface materials are used in a wide range of application field

Thermal Pad (Thermal Interface Material) is used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.