Stop by KGS America’s booth #1233 at OFC on 3/24-28, 2024

OFC is the largest global conference and exhibition for optical communications and networking professionals. The program is comprehensive — from research to marketplace, from components to systems and networks and from technical sessions to the exhibition. OFC draws attendees from all corners of the globe to meet and greet, teach and learn, make connections and move the industry forward.OFC 2024 expects to welcome 13,000
participants from 74 countries, 84 media outlets, and more than 603 companies exhibiting.

About Venue

OFC, the premier event in telecom and data center optics, will take place Tuesday, 26 March to Thursday, 28 March 2024. (Exhibition dates). The venue will be at the San Diego Convention Center. Health and safety measures will be implemented at the San Diego Convention Center and all associated properties.

Exhibition Schedule

Tuesday (3/26): 10:00AM ~ 5:00PM
Wednesday (3/27): 10:00AM ~ 5:00PM
Thursday (3/28): 10:00AM ~ 4:00PM

San Diego Convention Center

San Diego Convention Center
111 W Harbor Drive
San Diego, CA 92101

KITAGAWA INDUSTRIES America is featuring the following products at this OFC 2024.

KGS America Inc. Exhibitor Booth #1233

Four product types related to optical communications and networking professionals applications (EMI Ferrite / Ferrite Core, Thermal Pads, EMI Grounding, Vibration Damping Materials) are introduced here. Please feel free to contact us as there are many related products other than these products.

Putty does not drip even when thickly applied. Extremely useful in filling gaps with varying component heights. Very little compressive force on sensitive IC components and PCBs. No pre-mixing required! Putty is supplied ready to dispense. Automated dispensing possible with coating machine
Silicone-free base, great for any device, especially for sensitive optical applications

Thermal Putty: CPVG Series
Thermal Interface Material: CPVP-F Series

Many applications today such as optical, medical, and sensor devices have outgassing and oil bleeding requirements that prevent them from using silicone-based products. To meet these demands, we offer a variety of silicone-free thermal pads. Our silicone-free thermal pads use an acrylic base to eliminate any concerns of siloxane outgassing and silicone oil-bleeding. Our silicone-free thermal pads are very soft which is beneficial for reducing applied stress on the PCB and lowering the thermal resistance.

KITAGAWA INDUSTRIES America carries a large selection of onboard contacts (OG) that are excellent grounding materials for reducing EMI noise at the board level. Also, these parts give the ability to ground in the areas where screws are not used. Automated mounting on PC board is applicable. Multiple structures to meet different needs, these include specially designed compact types for narrow space configurations, space saving
types by reducing the required pad area, large height types for large clearances, and centered vacuum pick-up types in case of manufacturing automation requirements.

Standard Type: On-Board Contacts
EMI Absorbers

KGS brand EMI absorbers have a strong adhesive on one side to adhere to almost any surface. Most of KGS absorbers can be cut to size with scissors or cutting knife. The absorbers are simply applied directly on the noise source for effective EMC suppression before the noise can spread or cause cross-talk. Applying EMI absorbers at the noise source also allows to reduce the amount of material used on the device (as opposed to an entire wall or panel away from the noise source). EMI absorber materials can be time- and cost-saving solutions that can be used when there is no time or budget allotted to re-spin the board.

Please feel free to contact us with any questions regarding the above products. There is live chat on this site.