Thermal Putty: CPVG Series

Silicone-free, single-liquid, no-drip thermal putty

  • Putty does not drip even when thickly applied
  • Extremely useful in filling gaps with varying component heights
  • Very little compressive force on sensitive IC components and PCBs
  • No pre-mixing required! Putty is supplied ready to dispense

  • Automated dispensing possible

  • Silicone-free base, great for any device, especially for sensitive optical applications
Free sample and Quote Request

Properties

*Under development
Part Number CPVG-30 CPVG-50*
Thermal Conductivity (W/m•K) *ISO22007-2 Hot-disc method 3.0 5.0
Thermal Resistance t1.0mm (°C/W) *ASTM D5470 0.33 0.19
Thermal Resistance t0.3mm (°C/W) *ASTM D5470 0.08 0.05
Thermal Resistance t0.1mm (°C/W) *ASTM D5470 0.01 0.00
Color Gray Blue
Specific Gravity *JIS Z 8807 2.9 3.2
Viscosity 0.5 [1/s] (Pa•s) *ASTM D1824 Compliant 3,300 6,500
Viscosity 1.0 [1/s] (Pa•s) *ASTM D1824 Compliant 2,500 4,000
Volume Resistivity (Ω•cm) *JIS K 6911 Compliant 1.0 x 10⁹
Breakdown Voltage (kV/mm) *JIS K 6911 Compliant 8 12
Relative Permitivity 500MHz *Company Standard 8.98 13.47
Relative Permitivity 1GHz *Company Standard 8.88 13.58
Flame Resistance UL94 V-0 equivalent
Operating Temperature (°C) -40 ~ 125
Product form when supplied Cartridge: 330ml

*TEST METHOD

Results Of Drip Off Test

Other Company’s Grease

Other company’s grease: Dripped off

Dripped Off

CPVG-30

CPVG-30: No-drip off

No-drip Off

CPVG-50

CPVG-50: No-drip off

No-drip Off

Test Conditions:

Temperature: 125 °C
Time: 1000h
Coating thickness: t=1mm
Material: Glass + Aluminum plate

Workability of CPVG (Putty TIM) and the load on ICs

Workability of CPVG (Putty TIM) and the load on ICs

Compressive force and thermal conductivity

Comparison with sheet TIMs

Compress Force and Thermal Conductivity CPVG

* Specifications and dimensions are subject to change without notice for product improvement.