DesignCon 2023 will be held at Santa Clara Convention Center on 1/31-2/2 (Tue. ~ Thu.), 2023

DesignCon 2023 will be held at Santa Clara Convention Center on 1/31-2/2 (Tue. ~ Thu.), 2023

DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. Please join the DesignCon 2023 at the Santa Clara Convention Center January 31 ~ February 2 (Tue ~ Thu), 2023 for three days of education, exhibits, and networking. Registration has started and you can register here.

Our booth number is 813, and please check the floor map here.

About EXPO

DesignCon is the country’s largest gathering of chip, board, and systems designers. For 28 years, design engineers and other industry professionals come together in Silicon Valley to search for techniques and products to handle the latest signal and power integrity challenges. These potential buyers are the reason why 96% of 2022’s exhibitors stated that DesignCon is important for their business. – DesignCon

About Conference

With technical paper sessions, panels, tutorials, and boot camps spanning 14 tracks, DesignCon’s three-day conference program provides the information you need to solve design challenges now and plan how to improve designs in the future.

KITAGAWA INDUSTRIES America is featuring the following products at this DesignCon 2023.

KGS America Inc. Exhibitor Booth #813 (Check the floor plan)

Three product types related to optical communication (EMI Absorbers, Thermal Pads, EMI Grounding) are introduced here. Please feel free to contact us as there are many related products other than these products.

Putty does not drip even when thickly applied. Extremely useful in filling gaps with varying component heights. Very little compressive force on sensitive IC components and PCBs. No pre-mixing required! Putty is supplied ready to dispense. Automated dispensing possible with coating machine
Silicone-free base, great for any device, especially for sensitive optical applications

Thermal Putty: CPVG Series
Broadband EMI Absorber - IME8 Series

IME8 is high-performance broadband absorber for EMI suppression and ESD mitigation. Converts undesired EMI noise into negligible heat. Easy to apply directly at the noise source. Great for space-conscious applications. Recommended frequency range from 10MHz and above. Custom shapes available upon request.

CPVP Series is soft, 2W/m∙K silicone-free thermal putty, and it’s the Automotive-Grade. Super compliable (ASKER C 0) material sandwiched between thin permanent PET film and light tacky layer for easy handling. Thin permanent PET film provides mechanical strength and prevents dust and debris from getting trapped on the putty surface. Custom shapes available upon request.

Super-Soft Putty-like Silicone-Free Thermal Pad - CPVP Series
Automotive-Grade On-Board EMC Grounding Contact - OG-684296

OG-684296 is SMT-type, Tall EMC grounding contact for PCB’s in engine compartments, and it’s the Automotive-Grade. Spring mechanism withstands10 million compressions from engine vibrations. Unique dimple design allows for continued electrical contact. Operating temperature from -40℃ ~ +150℃, ideal for automotive applications.

IMTH70 series thermal pads have a high conductivity of 7.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses. They are also the superior and longer lasting solutions in comparison to thermal grease. Thermal grease or paste can be very difficult to handle. Its liquid form makes it messy to apply, and unless once completely covers an entire surface evenly, areas with less thermal grease will have less performance. Custom shapes available upon request.

Silicone-Base Thermal Pad: IMTH70 Series

Please feel free to contact us with any questions regarding the above products. There is live chat on this site.