Thermal Putty: CPVG Series
Silicone-free, single-liquid, no-drip thermal putty
Properties
*Under development
| Part Number | CPVG-30 | CPVG-50 |
|---|---|---|
| Thermal Conductivity (W/m•K) *ISO22007-2 Hot-disc method |
3.0 | 5.0 |
| Thermal Resistance t1.0mm (°C/W) *ASTM D5470 |
0.33 | 0.19 |
| Thermal Resistance t0.3mm (°C/W) *ASTM D5470 |
0.08 | 0.05 |
| Thermal Resistance t0.1mm (°C/W) *ASTM D5470 |
0.01 | – |
| Color | White | White |
| Specific Gravity *JIS Z 8807 |
2.9 | 3.2 |
| Viscosity 0.5 [1/s] (Pa•s) *ASTM D1824 |
3,300 | – |
| Viscosity 1.0 [1/s] (Pa•s) *ASTM D1824 |
2,500 | – |
| Viscosity 10rpm | 600 | 1000 |
| Recommended Thickness (mm) | 0.1 ~ 1.0 | 0.3 ~ 2.0 |
| Volume Resistivity (Ω•cm) *JIS K 6911 |
1.0 × 109 | 1.0 × 109 |
| Dielectric Breakdown Voltage (kV/mm) *JIS K 6911 |
8 | 3 |
| Dielectric Constant (1MHz) *Company Standard |
9.25 | 13.2 |
| Dielectric Loss Tangent (1MHz) *Company Standard |
0.06 | 0.07 |
| Shelf Life (25°C) *Company Standard |
6 months after delivery | 6 months after delivery |
| Flame Resistance *UL94 |
V-0 equivalent | V-0 equivalent |
| Operating Temperature (°C) | -40 ~ 125 | -40 ~ 130 |
| ※1 Sample size: φ25mm | ||
*TEST METHOD
Results Of Drip Off Test
Dripped Off
No-drip Off
No-drip Off
Test Conditions:
Temperature: 125 °C
Time: 1000h
Coating thickness: t=1mm
Material: Glass + Aluminum plate
Workability of CPVG (Putty TIM) and the load on ICs
Compressive force and thermal conductivity
Comparison with sheet TIMs
* Specifications and dimensions are subject to change without notice for product improvement.
