Silicone-Free Thermal Pad: CPSS Series

Ultra-soft (ASKER C 8) silicone-free thermal pad.

  • Super soft and compliable material allows for less pressure on the heat source, such as the IC or PCB, when compared to a standard TIM.
  • Pliability of the material allows for lower thermal resistance on an uneven surface.
  • Silicone-free material – no siloxane outgassing.
  • Suitable for vibration control.
  • Operating temperature -40 ~ 100°C

Structure

CPSS-F Series:
One side PET, one side naturally tacky

CPSS-F Series: one side PET, one side naturally tacky

CPSS Series:
Both sides naturally tacky

CPSS Series: both sides naturally tacky

Features

Soft type thermal pads provide low thermal resistance, while conforming well to uneven surfaces.

Soft type thermal pads provide low thermal resistance, while conforming well to uneven surfaces.

Soft type thermal pads more evenly distribute pressure.

Soft type thermal pads more evenly distribute pressure.

Typical Properties

ItemTest MethodCPSS-FCPSS
Thickness1.0, 1.5, 2.0, 2.5, 3.0, 4.04.0
Standard Sheet Size210 x 510210 x 510
Thermal Conductivity (W/m・K)JIS R 2616
(hot wire method)
2.02.0
Specific GravityJIS Z 88071.921.92
Hardness (ASKER C)JIS K 731288
Tensile Strength (MPa)JIS K 62510.28
Elongation (mm)JIS K 62516.21
Volume Resistivity (Ω・cm)JIS K 6911
(compliant)
1.0 x 10¹²1.0 x 10¹²
Breakdown Voltage (kV/mm)JIS C 2110-1
(compliant)
3.5
Withstanding Voltage (kV/mm)JIS C 2110-1
(compliant)
2.8
Dielectric Constant (1 MHz)Company Standard14.6
Loss Tangent (1 MHz)Company Standard0.09
Flame ResistanceUL94V-2 (t:1.0 – 3.0mm),
V-0 (t:4.0mm)
Operating Temperature (°C)-40 ~ 100-40 ~ 100
ColorDark GreenDark Green
Unit:mm

* Specifications and dimensions are subject to change without notice for product improvement.