Silicone-Free Thermal Pad: CPSS Series

Ultra-soft (ASKER C 8) silicone-free thermal pad.

  • Super soft and compliable material allows for less pressure on the heat source, such as the IC or PCB, when compared to a standard TIM.
  • Pliability of the material allows for lower thermal resistance on an uneven surface.
  • Silicone-free material – no siloxane outgassing.
  • Suitable for vibration control.
  • Operating temperature -40 ~ 100°C
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Structure

CPSS-F Series:
One side PET, one side naturally tacky

CPSS-F Series: one side PET, one side naturally tacky

CPSS Series:
Both sides naturally tacky

CPSS Series: both sides naturally tacky

Features

Soft type thermal pads provide low thermal resistance, while conforming well to uneven surfaces.

Soft type thermal pads provide low thermal resistance, while conforming well to uneven surfaces.

Soft type thermal pads more evenly distribute pressure.

Soft type thermal pads more evenly distribute pressure.

Typical Properties

Item Test Method CPSS-F CPSS
Thickness 1.0, 1.5, 2.0, 2.5, 3.0, 4.0 4.0
Standard Sheet Size 210 x 510 210 x 510
Thermal Conductivity (W/m・K) JIS R 2616
(hot wire method)
2.0 2.0
Specific Gravity JIS Z 8807 1.92 1.92
Hardness (ASKER C) JIS K 7312 8 8
Tensile Strength (MPa) JIS K 6251 0.28
Elongation (mm) JIS K 6251 6.21
Volume Resistivity (Ω・cm) JIS K 6911
(compliant)
1.0 x 10¹² 1.0 x 10¹²
Breakdown Voltage (kV/mm) JIS C 2110-1
(compliant)
3.5
Withstanding Voltage (kV/mm) JIS C 2110-1
(compliant)
2.8
Dielectric Constant (1 MHz) Company Standard 14.6
Loss Tangent (1 MHz) Company Standard 0.09
Flame Resistance UL94 V-2 (t:1.0 – 3.0mm),
V-0 (t:4.0mm)
Operating Temperature (°C) -40 ~ 100 -40 ~ 100
Color Dark Green Dark Green
Unit:mm

* Specifications and dimensions are subject to change without notice for product improvement.