Silicone Free Thermal Pad: CPVP-30-F Series

Silicone-free, low-hardness, high-thermally conductive pad (3W/m・K)

  • The two-layer structured putty can be handled in the same way as a pad

  • Has a thermal conductivity of 3.0W/m ∙ K, which is 2.1 times higher than the existing product

  • Silicone-free THERMAL PAD contains no siloxane

  • With excellent flexibility and stress relaxation, the assembled pad can lower the load on heating elements and PCBs

  • Recommended operating temperature: -40 ~125⁰C

  • Bleeds less oil compared with the silicone type

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Silicone Free Thermal Pad: CPVP-30-F Series

Cross-section View

CPVP-30-F: Cross-section View

Properties

*Under Development

Part Number CPVP-30-F
Thickness (mm) 1.0*, 1.5*, 2.0*, 3.0, 4.0
Thermal Conductivity (W/m•K) *ISO22007-2 Hot-disc method 3.0 (Low-hardness layer)
Hardness (ASKER C) *JIS K 7312 7 (Low-hardness layer)
Hardness (Shore OO) *ASTM D 2240 18 (Low-hardness layer)
Hardness (ASKER C) JIS K 7312
Volume Resistivity (Ω • cm) *JIS K 6911 1.0 x 10¹¹
Flame Resistance *UL94 Equivalent to V-0
Color Green / White

*Test Method

CPVP-30-F: Compression Force Test And Stress Relaxation
Test Conditions:

Sample Dimensions: 10mm (t=4.0mm)
Cross-head Speed: 1mm/min
Compression Plate Material: Upper: Stainless steel φ28mm / Lower: Gold plated copper φ106mm
*Compressive force is the largest load value immediately after compression