Frame Grounding Guide Rails: FGR Series

Molded black polycarbonate rail with spherical metal fingers provides simultaneous rigid guiding support and continuity of the ground draining circuit for the P.C. boards.

Holds cards firmly on designated positions in the package while the pressure developed by the metal fingers insures constant contact between chassis and the printed circuit for excellent current package.

Special spherical profile of the contact fingers prevents any scratching effect on the contact surface of the printed circuit (wiping action).

Contact resistance does not vary in the heat cycle test and remains stable under heavy vibration conditions.

Easy to assemble and fasten by snap-on rivet or screw mounting and very convenient for fast packaging and servicing operations.

Guiding, fastening and grounding of P.C. boards in various single-card or rack-package applications where electrical connection between the circuit on board and the frame (chassis) is required for EMI shielding or ESD suppression.