Onboard Plate: OGP-2520, OGP-3216, OGP-4520

OGP configuration ensures reliable contact.

  • OGP solves contact failure problems caused by solder flux
  • Better reliability compared with solder
  • Eliminates continuity failure caused by pattern scraping between a PCB and pogo pins and a PCB and a metal plate
  • OGP-2520 is 40 % or more downsized from OGP-4520. (Product size: 2.5 mm)
  • Gold-plated OGP-3216 can be used as a partial gold plating on PCBs

OGP-2520

Dimensions: OGP-2520

OGP-3216

Dimensions: OGP-3216

OGP-4520

Dimensions: OGP-4520

Material

Base material: Brass
Surface treatment: Sn reflow plating ※(First plating: Cu plating)
※Surface treatment for OGP-3216: Au/Ni plating on both sides.

Resistance Measurement Results

Test method:

1: A terminal and OGP-2520s are soldered on a substrate. A second terminal is soldered on to a separate substrate, with solder fillets applied on the substrate at the same position as the OGP.
2: A screw is tightened in each location and the substrates are heat treated.
3: After the treatment, the resistance between the terminal and screw is measured with a Milliohm HiTester.

Resistance Measurement Results: OGP-2520 and Solder

Treatment condition: 125℃

Application Examples

Application Examples: OGP-2520, OGP-4520
Screw loosening prevention and automated mounting

Screw loosening prevention and automated mounting

WashersOGP Series
Mounting MethodManualAutomated
  • Cost saving by automa?on!
  • Parts are automatically counted by mounters.

* Specifications and dimensions are subject to change without notice for product improvement.

Advancements in communication technologies have made it possible to transmit more data at high speeds, allowing industrial equipment to perform simple to complex tasks. In addition, the introduction of Artificial Intelligence (AI) in the factory setting is being considered to further improve productivity.