Onboard Plate: OGP-2520, OGP-3216, OGP-4520

OGP configuration ensures reliable contact.

OGP solves contact failure problems caused by solder flux
Better reliability compared with solder
Eliminates continuity failure caused by pattern scraping between a PCB and pogo pins and a PCB and a metal plate
OGP-2520 is 40 % or more downsized from OGP-4520. (Product size: 2.5 mm)
Gold-plated OGP-3216 can be used as a partial gold plating on PCBs

Free sample and Quote Request

Dimensions
Properties

Dimensions

OGP-2520

OGP-3216

OGP-4520

Material

Base material: Brass
Surface treatment: Sn reflow plating ※(First plating: Cu plating)
※Surface treatment for OGP-3216: Au/Ni plating on both sides.

Properties

Resistance Measurement Results

Test method:

1: A terminal and OGP-2520s are soldered on a substrate. A second terminal is soldered on to a separate substrate, with solder fillets applied on the substrate at the same position as the OGP.
2: A screw is tightened in each location and the substrates are heat treated.
3: After the treatment, the resistance between the terminal and screw is measured with a Milliohm HiTester.

Treatment condition: 125℃

Application Examples

Screw loosening prevention and automated mounting

	Washers	OGP Series
Mounting Method	Manual	Automated

Cost saving by automa?on!
Parts are automatically counted by mounters.

* Specifications and dimensions are subject to change without notice for product improvement.

KGS Ferrite Cores Support Changing Factory Requirements Towards Industry 4.0

Advancements in communication technologies have made it possible to transmit more data at high speeds, allowing industrial equipment to perform simple to complex tasks. In addition, the introduction of Artificial Intelligence (AI) in the factory setting is being considered to further improve productivity.