Side Contact: OGSC-T-302020 and OGSC-B-302020

Side contact for perpendicular grounding.

  • Ideal for applications where standard grounding between parallel boards/chassis is not possible
  • Due to low profile design (2mm), it’s suitable for small electronic devices
  • Operating temperature -40ºC ~ 150ºC

Direction of Metal Chassis Slip

For slipping metal chassis from top
OGSC-T-302020

OGSC-B-302020

For slipping metal chassis from bottom
OGSC-B-302020

OGSC-T-302020
Dimensions: OGSC-T-302020 and OGSC-B-302020

Specifications

Part No.OGSC-T-302020OGSC-B-302020
ApplicationsGround Contact for SMD
MaterialCorson alloy (t0.08mm)
Compression Range (mm)0.3 ~ 1.0
Surface TreatmentSn reflow plating (Underlying Cu plating)
Operating Temperature (°C)-40 ~ 125
Initial Resistance (Ω)≤0.05
Initial Compression Force (N)0.2 ~ 3.10.4 ~ 3.0
Unit:mm

Heat Cycle Test

Heat Cycle Test: OGSC-T-302020 and OGSC-B-302020

* Specifications and dimensions are subject to change without notice for product improvement.