On‐board Contact for Parallel EMC Grounding: OG‐321605
On-board grounding component designed for small gaps.
- Low profile contact designed for space conscious applications
- Spring force ensures contact returns to its original height after being fully compressed
- Recommended height: 0.35mm or less
- Applications include mobile devices and wearable gear
Dimensions (mm)
Pad Design (mm)
Mark Design (mm)
| Part No. | OG‐321605 |
|---|---|
| Length | 3.2 mm |
| Width | 1.6 mm |
| Height | 0.5 mm |
| Recommended Gap | 0.35 mm or less |
| Base Material | Phosphor Bronze |
| Surface Treatment | Sn plating, Cu undercoat |
| Qty per Reel | 4,000 pcs |
Unit:mm
Compression Force vs. Electric Resistance
Application
* Specifications and dimensions are subject to change without notice for product improvement.