On‐board Contact for Parallel EMC Grounding: OG‐321605

On-board grounding component designed for small gaps.

  • Low profile contact designed for space conscious applications
  • Spring force ensures contact returns to its original height after being fully compressed
  • Recommended height: 0.35mm or less
  • Applications include mobile devices and wearable gear
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OG‐321605

Dimensions (mm)

Dimension: OG-321605

Pad Design (mm)

Pad Design: OG-321605

Mark Design (mm)

Mark Design: OG-321605
Part No. OG‐321605
Length 3.2 mm
Width 1.6 mm
Height 0.5 mm
Recommended Gap 0.35 mm or less
Base Material Phosphor Bronze
Surface Treatment Sn plating, Cu undercoat
Qty per Reel 4,000 pcs
Unit:mm

Compression Force vs. Electric Resistance

OG-321605: Compression Force vs Electric Resistance

Application

OG-321605: Application
OG-321605: Application

* Specifications and dimensions are subject to change without notice for product improvement.