On‐board Contact for Parallel EMC Grounding: OG‐321605

On-board grounding component designed for small gaps.

  • Low profile contact designed for space conscious applications
  • Spring force ensures contact returns to its original height after being fully compressed
  • Recommended height: 0.35mm or less
  • Applications include mobile devices and wearable gear
OG‐321605

Dimensions (mm)

Dimension: OG-321605

Pad Design (mm)

Pad Design: OG-321605

Mark Design (mm)

Mark Design: OG-321605
Part No.OG‐321605
Length3.2 mm
Width1.6 mm
Height0.5 mm
Recommended Gap0.35 mm or less
Base MaterialPhosphor Bronze
Surface TreatmentSn plating, Cu undercoat
Qty per Reel4,000 pcs
Unit:mm

Compression Force vs. Electric Resistance

OG-321605: Compression Force vs Electric Resistance

Application

OG-321605: Application
OG-321605: Application

* Specifications and dimensions are subject to change without notice for product improvement.