Side Contact: OGSC-T-302020 and OGSC-B-302020

Side contact for perpendicular grounding.

  • Ideal for applications where standard grounding between parallel boards/chassis is not possible
  • Due to low profile design (2mm), it’s suitable for small electronic devices
  • Operating temperature -40ºC ~ 150ºC
Free sample and Quote Request
Side Contacts for Perpendicular Grounding: OGSC Series

Direction of Metal Chassis Slip

For slipping metal chassis from top
OGSC-T-302020

OGSC-B-302020

For slipping metal chassis from bottom
OGSC-B-302020

OGSC-T-302020
Dimensions: OGSC-T-302020 and OGSC-B-302020

Specifications

Part No. OGSC-T-302020 OGSC-B-302020
Applications Ground Contact for SMD
Material Corson alloy (t0.08mm)
Compression Range (mm) 0.3 ~ 1.0
Surface Treatment Sn reflow plating (Underlying Cu plating)
Operating Temperature (°C) -40 ~ 125
Initial Resistance (Ω) ≤0.05
Initial Compression Force (N) 0.2 ~ 3.1 0.4 ~ 3.0
Unit:mm

Heat Cycle Test

Heat Cycle Test: OGSC-T-302020 and OGSC-B-302020

* Specifications and dimensions are subject to change without notice for product improvement.