On‐board Contact for Parallel EMC Grounding: OG-503253-A

SMT grounding contact for engine compartment PCB.

Spring mechanism capable of withstanding 10 million deflections caused by engine vibration.
Sustained conduction is secured because of unique dimple design.
Can be used under high temperature at 150 ºC.

Dimensions
Properties

Dimensions

Dimensions (mm)

Pad and Mask Dimensions (mm)

Compression Force vs Electric Resistance

Part No.	OG‐503253‐A
Applications	[/fusion_text]Ground clip for SMD
Length	5.0 mm
Width	3.2 mm
Height*	5.25 mm
Recommended Gap	3.5 ~ 4.5 mm
Base Material	Beryllium Copper
Surface Treatment	Sn plating, Cu undercoat
Qty per Reel	2,000 pcs
Operating Temperature	‐40 ~ 150 °C

* Dimple included on the top surface of OG‐503253‐A to maintain metal‐to‐metal connection during vibration.

Properties

Heat-shock Test

Temperature switch: -40 °C/150 °C (0.5 hour each)
Number of cycle: 2000 cycles
Metal plate: Aluminum (ADC 12)
Test method: Sample is compressed by metal plate while heat is applied.
After a set of 250 cycles the DC resistance value is measured.

Compression Test

	Before	After
External status
Height (mm)	5.263	5.226
Recovery rate (%)	–	99.7

Deflection: H=3.5 mm ~ 3.9 mm
Compression count : 10 million times
Compression speed: 100 times/sec
Test method: Height measured and visual check after compressed 3.5 mm ~ 3.9 mm deflections for 10 million times.

* Specifications and dimensions are subject to change without notice for product improvement.

KGS On-board Contacts Support Changing Factory Requirements Towards Industry 4.0

Advancements in communication technologies have made it possible to transmit more data at high speeds, allowing industrial equipment to perform simple to complex tasks. In addition, the introduction of Artificial Intelligence (AI) in the factory setting is being considered to further improve productivity.