On‐board Contact for Parallel EMC Grounding: OG‐160810

Tiny profile, board-level EMC grounding component.

  • Compact design, great for space-conscious applications such as smart and wearable devices.
  • Au plating for stable contact resistance.
  • Tape-and-reel design for automated mounting.
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OG‐160810

Dimensions (mm)

Dimension: OG-160810

Pad Design (mm)

Pad Design: OG-160810

Mark Design (mm)

Mark Design: OG-160810
Part No. OG-160810
Recommended Gap (mm) 0.7 ~ 0.9
Material Beryllium Copper
Surface Treatment Base: Ni Finish: Partial Au
Operating Temperature (°C) -40 ~ +125
Unit:mm

Compression Force vs Electric Resistance

OG-160810: Compression Force vs Electric Resistance

Repetitive Compression Set

OG-160810: Repetitive Compression Set

* Specifications and dimensions are subject to change without notice for product improvement.