On‐board Contact for Parallel EMC Grounding: OG‐160810
Tiny profile, board-level EMC grounding component.
- Compact design, great for space-conscious applications such as smart and wearable devices.
- Au plating for stable contact resistance.
- Tape-and-reel design for automated mounting.
- RoHS Compliant
Dimensions (mm)
Pad Design (mm)
Mark Design (mm)
| Part No. | OG-160810 |
|---|---|
| Recommended Gap (mm) | 0.7 ~ 0.9 |
| Material | Beryllium Copper |
| Surface Treatment | Base: Ni Finish: Partial Au |
| Operating Temperature (°C) | -40 ~ +125 |
Unit:mm
Compression Force vs Electric Resistance
Repetitive Compression Set
* Specifications and dimensions are subject to change without notice for product improvement.